● Thickness(Min)　Specification：0.05mm 　Mass Production：0.05mm

● Thickness(Max)　Specification：1.6mm　Mass Production：1.5mm

● Board Size(Min)　Specification：12”*14”

● Board Size(Max)　Specification：24”*28”

● Line Width / Space(Min)　Specification：50/50μm　Mass Production：50/62.5μm

● Thickness：4mil 1/1　● Line Width：3mil　● Line Space：2.5mil　● Type：Mobile Phone

● Sulfuric Acid-H2O2 Serious—auto-control concentration

● Microetch Rate:0.4~1.0μm

● Cupric sulfate restore machine

● Roller Type:56grooves

● 5 Oven Section(1 section IR.3 section heating.1 section cooling)

● Film thickness:7.5~10.0μm

(Liquid film:MacDermid 1430)

● Resolution: 50μm

● Productivity: 3 panel/min

● Registration: 25μm

● Alignment System: Double CCD alignment

● Developer: Na2CO3 (dosing automatic by area)

● Etching:CuCl2(HCl. H2O2 system) AUQA control

● Stripping : NaOH (dosing automatic by area)